Toluene diisocyanate manufacturer Knowledge Japan’s Shin-Etsu Silicone Thermally Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (Single Component) KE-1867, KE-1891

Japan’s Shin-Etsu Silicone Thermally Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (Single Component) KE-1867, KE-1891

author: Post: 09/05/2023 51read Comments Off

Thermally conductive adhesive additional reaction type (one-component type)

		KE-1867	KE-1891
Cure Type		Append	append
Appearance		gray	gray
Viscosity	Pa-s	60	Paste
Standard curing time	min	120℃×1 hour
Characteristics after curing
Density (23℃)		2.92	3.06
hardness	TypeA	75	96
stretch length	%	60	10
Tensile Strength	MPa	2.1	4.8
Bond strength Al / Al	MPa	1.0	0.8
Heat conductivity	W/m-k	2.2	4.0
Flame Retardancy: UL94		V-0	V-0

Features

The glue before curing is medium Viscosity ~ paste and other types of viscosity, suitable for bonding of heating parts

Take an example

Substrate parts fixing, etc.

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The glue before curing is medium Viscosity ~ paste and other types of viscosity, suitable for bonding of heating parts

Take an example

Substrate parts fixing, etc.

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