Japan’s Shin-Etsu silicone thermal conductive material non-curable thermal grease G 776, G 787, G 790

Advantages of silicone-based thermally conductive resin

Compared with non-silicone systems, there is a reduction in heat after various reliability tests blocking effect.

Different products can be selected according to film thickness

Through film adjustment to reduce thermal resistance - G-OOO series

When you need to use a thick film - choose CLG, SDP series

Product Name	G-OOO Series		CLG series	SDP series
Type	Single component type			two-component type
Features	Non-curing	curing type (condensation, addition)	Non-curing	curing type (additional)
	use film		filler

Non-curing thermal grease containing solvent type

	G-776	G-787	G-790
Feature	Standard	highheat conduction	Low thermal resistance
Appearance	White	White	white
Density: 25℃	2.9	3.48	3.2
Viscosity (Pa-s)Volatilefront	60	70	80
Viscosity (Pa-s)Volatileafter	500	200	290
Volatilization (%) 150℃ X 24h	3.1	0.93	1.03
Heat conductivity (W/m-K) before volatilization	1.0	3.3	2.6
Thermal conductivity (W/m-K) after volatilization	1.3	4.0	3.0
BLT thickness (μm)	8	32	9
Thermal resistance (mm2-K/W)	7.4	9.5	4.7
Breakdown voltage (kV/0.25mm)	2.5	2.4	2.5
Applicable temperature range (℃)	-40 ~ 200	-40 ~ 200	-40 ~ 200

2.6

Thermal conductivity (W/m-K) after volatilization 1.3 4.0 3.0

BLT thickness (μm)

8

32

9

Thermal resistance (mm2-K/W)

7.4

9.5

4.7

Breakdown voltage (kV/0.25mm)

2.5

2.4

2.5

Applicable temperature range (℃)

-40 ~ 200

-40 ~ 200

-40 ~ 200