Product Introduction
XP 2458 is used as a matrix in a solvent-free moisture-curing one-component system used in resin. By adjusting the process system, no air bubbles will be generated during the curing process. This product is mainly used for one-component moisture-curing adhesives. Typical application areas include wood, plastic and metal adhesives. The adhesive performance of the product can be effectively enhanced by adding suitable fillers. XP 2458 can also be used in moisture-curing sealant and coating formulations.
Typical parameters
Features |
Value |
Appearance |
Slight yellow transparent liquid |
Viscosity@23 ℃, mPs |
35000 |
Specific gravity@20℃, g/cm3 |
1.023 |
Quality@20℃, lb |
8.54 |
Flash point ℃ |
156 |
Minimum temperature flow point℃ |
-6 |
Compatibility
XP 2458 is soluble in typical plasticizers and aromatic solvents.
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The Product should be stored in a cool, airtight container. An increase in storage temperature (above 30°C) will increase the viscosity of the product. The maximum storage temperature for this product is 50°C, and the shelf life in an airtight container is six months from the date of receipt.