The distinction and types of thermally conductive silicone
| differentiate | kind | performance |
| thermally conductive adhesive | ①hardening type (condensation reaction/additional reaction) | self-adhesive |
| thermal grease |
①hardening type ②Non-curing |
Reworkability (no adhesion) Reworkability (no adhesion) |
|
thermal silicone |
distinguish |
Type |
|
Product name |
|
thermally conductive adhesive |
hardened |
One-component condensation (room temperature curing) |
KE-4961-W, KEN-4988-W (Nantong products) |
|
|
KE-4962-W, KE-3467 |
||||
|
One-component addition (heat curing) |
KE-1867, KE-1891 |
|||
|
two-component additive (heat curing) |
KE-1285-AB, KE-1292-AB, X-32-3705-AB (Nantong product) |
|||
|
KE-1897-AB, KE-1898-AB, KE-1899-AB |
||||
|
two-component addition (low temperature curing) |
KE-1184-AB, KE-1185-AB |
|||
|
thermal grease |
Non-hardening |
Solvent-free (thin layer) |
G-775, G-777, G-779 |
|
|
Solvent-based (thin coat) |
G-776, G-790, G-787 |
|||
|
Solvent-based (thin and thick film) |
CLG Series |
|||
|
hardened |
One-component condensation (room temperature curing) |
G-1000 |
||
|
One-component addition (heating/UV) |
G-789, GUV-300 |
|||
|
two-component additive (room temperature curing)
|
SDP Series |
About condensation and addition reactions
Cure Types and Features
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