Toluene diisocyanate manufacturer Knowledge BASF hydroxyethylethylenediamine AEEA 111-41-1

BASF hydroxyethylethylenediamine AEEA 111-41-1

BASF hydroxyethylethylenediamine AEEA 111-41-1

Hydroxyethylethylenediamine AEEA

Molecular formula: C4H120N2

Molecular mass: 104.15

The structural formula is: H2NCH2CH2NHCH2CH2OH

Appearance: light yellow to yellow viscous liquid with ammonia odor, non-irritating . Soluble in water and ethanol, easy to absorb moisture.

Hydroxyethylethylenediamine can be used as light stabilizer in paint and coating industry Raw materials for the production of vulcanization accelerators, carboxylation of amino groups to generate metal ion chelating agents, cleaning of zinc-nickel-nickel (copper-nickel-zinc alloy) coins as detergents to prevent browning, lubricating oil additives (can be directly combined with methacrylic acid copolymers) As preservatives and oil dispersants), synthetic resins such as water-based emulsion coatings, paper sizing agents and hair sprays, etc. It also has certain uses in petrochemical and other aspects.

Hydroxyethylethylenediamine is used as a surfactant raw material, which can produce excellent performance Amphoteric imidazoline surfactants for various shampoos, body washes, and personal and industrial cleaning agents. At the same time, it can also produce cationic imidazoline surfactants with good anti-corrosion and corrosion inhibition effects, strong emulsifying ability, and good dispersion performance. Alkyl imidazoline series amphoteric surfactants. It has excellent foaming and wettability, stability to pH changes, low toxicity, complete biodegradation, and no irritation to skin and eyes.

Hydroxyethylethylenediamine is commonly used as curing agent and wetting agent. It can be widely used for bonding various metals and non-metals, preparing anti-corrosion epoxy coatings and chemical grouting agents, etc. As a curing agent, it is mainly compounded with epoxy resin, such as for non-metal and metal bonding, and can also be used for casting of machinery, electrical components and cable joints. The active period of the curing agent is about 25 minutes at 20°C, the curing speed is about twice as slow as that of ethylenediamine, and it has a plasticizing effect.

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