Japan’s Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Condensation Reaction Type (Single Component) KE-4961-W, KEN-4988-W, KE-4962-W, KE-3467

Thermal conductivity Adhesive condensation reaction type (one-component type)

		KE-3467	KE-4961-W	KE-4962-W	KEN-4988-W
Cure Type		condensation (removal of acetone)	condensation (dealcoholization)	condensation (dealcoholization)	condensation (dealcoholization)
Appearance		White	White	White	White
Viscosity	Pa-s	100	Paste	Paste	Paste
Surface dry time	min	4	1	1	2
Physical properties after curing
Density (23℃)		2.9	2.34	2.65	1.61
Hardness	TypeA	91	80	88	76
stretch length	%	30	60	30	70
Tensile Strength	MPa	3.6	4.4	4.4	4.0
Bond strength Al / Al	MPa	0.5	0.7	0.8	1.0
Heat conductivity	W/m-k	2.4	1.6	2.4	0.75
Flame Retardancy: UL94		V-0	V-0	V-0 is quite	V-0 quite (3mm)

Features

The glue before curing has various types of viscosity such as medium viscosity to paste, suitable for use Adhesive to heat generating partstensile strength

MPa

3.6

4.4

4.4

4.0

Bond strength

Al / Al

MPa

0.5

0.7

0.8

1.0

Heat conductivity

W/m-k

2.4

1.6

2.4

0.75

Flame Retardancy: UL94

V-0

V-0

V-0 is quite

V-0 quite (3mm)

Features

The glue before curing has various types of viscosity such as medium viscosity to paste, suitable for use Adhesion to heat generating parts

Use Example

substrate parts fixing, etc.

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Use Example

substrate parts fixing, etc.