Japan’s Shin-Etsu silicone thermal conductive material non-curable thermal grease G 775, G 777, G 779

Advantages of silicone-based thermally conductive resin

Compared with non-silicone systems, there is a reduction in heat after various reliability tests blocking effect.

Different products can be selected according to film thickness

Through film adjustment to reduce thermal resistance - G-OOO series

When you need to use a thick film - choose CLG, SDP series

Product Name	G-OOO Series		CLG series	SDP series
Type	Single component type			two-component type
Features	Non-curing	curing type (condensation, addition)	Non-curing	curing type (additional)
	use film		filler

Non-curing thermal grease does not contain solvent type

	G-775	G-777	G-779
Feature	Sag resistance	Standard	Low thermal resistance
Appearance	White	White	white
Density: 25℃	3.4	3.3	3.21
Viscosity (Pa-s)	500	140	160
Volatilization (%) 150℃ X 24h	0.26	0.10	0.18
Heat conductivity (W/m-K)	3.6	3.3	3.0
BLT thickness (μm)	75	59	25
Thermal resistance (mm2-K/W)	25	21	11
Breakdown voltage (kV/0.25mm)	2.5	3.4	3.2
Applicable temperature range (℃)	-40 ~ 150	-40 ~ 200	-40 ~ 200

n style="color:#000000">thermal resistance (mm2-K/W)

Breakdown voltage (kV/0.25mm)

2.5

3.4

3.2

Applicable temperature range (℃)

-40 ~ 150

-40 ~ 200