Toluene diisocyanate manufacturer Knowledge Kao Cleanthrough A series dry bun peeling liquid A-07 A-06 A-11D

Kao Cleanthrough A series dry bun peeling liquid A-07 A-06 A-11D

author: Post: 09/05/2023 330read Comments Off

Product List

	A-07 A-11D	A-06 （A-06A+B)	DevelopmentA	DevelopmentB
purpose	Low Corrosion Solder bump	precision SAP thick Dry Film	No ContainsTMAH precision SAP	Pan WithSAP
TMAH	Contains	Contains	No Contains	No Contains
organic amine	Contains	Contains	Contains	No Contains
Price	Center	Center	Middle high	Low

Product Features
A-07/A-11D: Low Corrosivity
-Prevent corrosion of metal and other peripheral materials
A06: Quick peel off
- High permeability, fine film fragmentation, 30% shorter peeling time than commercially available products
- Suitable for thick film and precision circuit, film thickness ≥100µmt; pitch L/S < 6/6µm
- High resistance to CO2 degradation, 200% more stable to carbonates than commercially available products
Development product: TMAH free
Developed product A - high efficiency type, suitable for precise SAP process
Development product B - general purpose, such as CSP

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