
2,6-Difluorobenzamide (DFBA) is mainly used in pesticide production, with global production capacity concentrated in China.
2,6-Difluorobenzamide, referred to as DFBA, is a chemical substance with the chemical formula C7H5F2NO. It appears as a white to off-white powder. It is insoluble in water, easily soluble in organic s…

SiCf/SiC composite materials are key materials for a new generation of aero-engines and have huge market development potential.
SiCf/SiC composite material, the full name of silicon carbide fiber reinforced silicon carbide ceramic matrix composite material, refers to a composite material formed by introducing silicon carbide f…

Favored by the dual factors of growing demand and improving standards, the waterproof mortar industry has huge development potential
Waterproof mortar refers to a kind of mortar used to make waterproof layers. It is mainly composed of cement, aggregate and waterproof additives and other materials. It belongs to a category of specia…

Spherical alumina has a wide range of applications. my country is the world’s leading producer.
Spherical alumina refers to an alumina powder material generated from ordinary irregular-shaped alumina (Al2O3) through high-temperature melt spraying, calcination, screening, purification and other p…

The domestic graphene copper industry has successfully piloted and has broad prospects for future development.
Graphene copper, also known as “super copper”, is a composite material of graphene and copper. It is made of copper as the matrix and graphene as the reinforcing phase. It has high electri…

Polyacrylic acid (PAA) binder market has huge development potential, and lithium-ion batteries are its main demand end
PAA adhesive, also known as polyacrylic acid adhesive, refers to a chain-like polymer water-based adhesive that appears as a colorless or light yellow liquid. PAA binder is an important type of lithiu…

The trend of wafer thinning is rising, and the development of the temporary bonding adhesive (TBA) industry is ushering in a period of opportunity.
Temporary bonding adhesive, referred to as TBA, refers to an intermediate layer material used to bond functional wafers and temporary carrier boards. It generally has low cost, high adhesion, good the…

The market demand for underfill glue continues to grow, and there are a large number of companies with global presence.
Underfill glue (Underfill glue), also known as underfill agent and underfill, refers to a thermosetting one-component, modified epoxy resin glue. Underfill glue is mainly used in the circuit board ass…